Semiconductor package structure
AssigneeMediatek Inc.
InventorsTzu-Hung Lin, Yuan-Chin Liu
Life of this patent
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Abstract
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first semiconductor die, and a second semiconductor die. The substrate includes a first substrate partition and a second substrate partition. The first substrate partition has a first wiring structure. The second substrate partition is adjacent to the first substrate partition and has a second wiring structure. The first substrate partition and the second substrate partition are surrounded by a first molding material. The first semiconductor die is disposed over the substrate and electrically coupled to the first wiring structure. The second semiconductor die is disposed over the substrate and electrically coupled to the second wiring structure.
Claims21
A semiconductor package structure, comprising:
- a substrate having a first surface and a second surface opposite to the first surface and comprising:
- a first substrate partition having a first wiring structure;
- and
- a second substrate partition adjacent to the first substrate partition and having a second wiring structure,
- wherein the first substrate partition and the second substrate partition are surrounded by a first molding material;
- a first semiconductor die disposed over the first surface of the substrate and electrically coupled to the first wiring structure;
- a second semiconductor die disposed over the first surface of the substrate and electrically coupled to the second wiring structure;
- and
- a plurality of bump structures disposed over the second surface of the substrate, wherein the first molding material extends from the first surface of the substrate to the second surface of the substrate.
A semiconductor package structure, comprising:
- a first substrate having a first surface and a second surface opposite to the first surface and having a first wiring structure;
- a second substrate having a third surface and a fourth surface opposite to the third surface and having a second wiring structure, wherein the first substrate and the second substrate are arranged side-by-side and surrounded by a molding material;
- a redistribution layer disposed over the first surface of the first substrate and the third surface of the second substrate, wherein the redistribution layer is electrically coupled to the first wiring structure and the second wiring structure;
- a frame surrounding the first substrate and the second substrate;
- and
- a plurality of bump structures disposed over the second surface of the first substrate and the fourth surface of the second substrate, wherein the molding material extends from the first surface of the first substrate and the third surface of the second substrate to the second surface of the first substrate and the fourth surface of the second substrate.
A semiconductor package structure, comprising:
- a first substrate having a first surface and a second surface opposite to the first surface and having a first wiring structure;
- a second substrate having a third surface and a fourth surface opposite to the third surface and having a second wiring structure, wherein the first substrate and the second substrate are arranged side-by-side and surrounded by a molding material;
- a first semiconductor die disposed over the first surface of the first substrate and electrically coupled to the first wiring structure;
- a second semiconductor die disposed over the third surface of the second substrate and electrically coupled to the second wiring structure;
- a plurality of first antenna structures disposed over the first surface of the first substrate and electrically coupled to the first wiring structure;
- a plurality of second antenna structures disposed over the third surface of the second substrate and electrically coupled to the second wiring structure;
- and
- a plurality of bump structures disposed over the second surface of the first substrate and the fourth surface of the second substrate, wherein the molding material extends from the first surface of the first substrate and the third surface of the second substrate to the second surface of the first substrate and the fourth surface of the second substrate.
Dependencies are inferred from the claim text.