Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising the steps of:

• fixing a semiconductor device to a lead frame comprising a first lead terminal, a second lead terminal, and a tie bar connecting the first lead terminal and the second lead terminal, the tie bar comprising a first narrow-width section touching the first lead terminal, a second narrow-width section touching the second lead terminal, and a wide-width section having a larger width than the first narrow-width section and the second narrow-width section and connecting the first narrow-width section and the second narrow-width section;
• performing transfer molding to form resin covering the semiconductor device using a runner channel provided along the tie bar;
• performing removal by fixing any one of an upper end portion and a lower end portion of the wide-width section of the tie bar with a holding jig and inserting a runner pushing pin into a through-hole provided between the first narrow-width section and the second narrow-width section in the wide-width section to flick away a runner adhering to the tie bar;
• and
• cutting the first narrow-width section and the second narrow-width section.