Method of packaging a semiconductor die

A method, comprising:

• securing an interposer frame to a carrier, wherein the interposer frame has a plurality of conductive columns;
• attaching a semiconductor die to the carrier in an opening of the interposer frame, wherein a bottom surface of the semiconductor die is co-planar with a bottom surface of the interposer frame;
• forming a molding compound to fill space between the semiconductor die and the interposer frame, wherein the molding compound covers a top surface of each of the plurality of conductive elements and a top surface of the semiconductor die;
• removing a portion of the molding compound to expose the top surface of the semiconductor die;
• and
• forming a redistribution layer directly contacting the top surface of the semiconductor die and a top surface of the molding compound, wherein a conductive material of the redistribution layer is continuous and directly contacts the top surface of the semiconductor die and the top surface of the interposer frame.

A method comprising:

• securing an interposer frame to a carrier, wherein the interposer frame has a plurality of conductive columns;
• attaching a semiconductor die to the carrier in an opening of the interposer frame, wherein a first distance from a top surface of the semiconductor die to a top surface of the carrier is greater than a second distance from a top surface of the interposer frame to the top surface of the carrier;
• forming a conductive element on a top surface of a first conductive column of the plurality of conductive columns;
• forming a molding compound to fill space between the semiconductor die and the interposer frame, wherein the molding compound covers the top surface of the semiconductor die;
• exposing the top surface of the semiconductor die;
• and
• forming a redistribution layer directly contacting the top surface of the semiconductor die and a top surface of the molding compound, wherein the redistribution layer is electrically connected to the first conductive column.