Semiconductor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChung-Jung Wu, Chih-Hang Tung, Tung-Liang Shao, Sheng-Tsung Hsiao, Jen-Yu Wang
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Abstract
A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
Claims20
A semiconductor device, comprising:
- a package, comprising a first die having an active surface and a rear surface opposite to the active surface, wherein the rear surface has a cooling region and a peripheral region enclosing the cooling region, and the first die comprises micro-trenches located in the cooling region of the rear surface;
- and
- a cooling cover stacked on the first die, wherein the cooling cover comprises a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches, and the cooling cover has a seal trench at a floor panel facing toward the first die;
- and
- a seal ring, filled in the seal trench and in contact with the peripheral region of the first die, wherein a space between the cooling cover and the micro-trenches is sealed by the seal ring.
A semiconductor device, comprising:
- a package, comprising:
- a substrate;
- an interposer disposed over and electrically connected to the substrate;
- and
- a die disposed over and electrically connected to the interposer, wherein the die comprises a continuous ring pattern and discontinuous patterns enclosed by the continuous ring pattern on an upper surface of the die opposite to the interposer;
- and
- a cooling cover stacked on the die, wherein the cooling cover comprises a fluid inlet port and a fluid outlet port located over the discontinuous patterns, the cooling cover further comprises a fluid inlet channel connected to the fluid inlet port and a fluid outlet channel connected to the fluid outlet port, and each of the fluid inlet channel and the fluid outlet channel laterally spans to overlap a group of the micro-trenches.
A manufacturing method of a semiconductor device, comprising:
- providing a die having an active surface and a rear surface opposite to the active surface, wherein the rear surface has a cooling region and a peripheral region enclosing the cooling region;
- forming micro-trenches in the cooling region of the rear surface;
- placing the die on an interposer such that the active surface of the die faces the interposer;
- placing the interposer on a substrate;
- and
- attaching a cooling cover to the rear surface of the die, wherein the cooling cover comprises a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches, the cooling cover further comprises a fluid inlet channel connected to the fluid inlet port and a fluid outlet channel connected to the fluid outlet port, and each of the fluid inlet channel and the fluid outlet channel laterally spans to overlap a group of the micro-trenches.
Dependencies are inferred from the claim text.