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US 11,387,163 B2Granted
Scalable debris-free socket loading mechanism
AssigneeIntel Corporation
InventorsAndrew Larson, Bijoyraj Sahu, Craig J. Jahne, Eric W. Buddrius, Ralph V. Miele
Life of this patent
Estimating the term…
Abstract
A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
Claims16
A microprocessor heat sink fastener, comprising:
- a nut comprising a thermoplastic material and fibrous fill particles;
- and
- a bore extending along an axis of the nut, the bore defining a plurality of internal threads of the nut adjacent a bulk region of the nut, each internal thread comprising a plurality of first fibers having first and second terminating ends extending toward the bulk region and terminating within each internal thread, wherein the bulk region comprises a plurality of second fibers, and wherein the first fibers comprise a first average curvature of fibrous fill particles and the second fibers comprise a second average curvature of fibrous fill particles of fibrous fill particles less than the first average curvature.
Dependencies are inferred from the claim text.