Package with thermal interface material retaining structures on die and heat spreader

A method of forming a device package, comprising:

• disposing one or more dies on a substrate, wherein each of the dies has a top surface and a bottom surface that is opposite from the top surface;
• disposing a retaining structure between a bottom surface of a lid and the top surface of the die, wherein the retaining structure has one or more inner walls;
• depositing a thermal interface material within the one or more inner walls of the retaining structure and above the die;
• and
• disposing the lid with one or more legs on an outer periphery of the lid, a top surface, and the bottom surface that is opposite from the top surface on the substrate, wherein the one or more legs of the lid are attached to the substrate with a sealant, wherein the bottom surface of the lid has a recess therein, wherein the retaining structure extends into the recess in the bottom surface of the lid, and wherein the thermal interface material extends into the recess in the bottom surface of the lid.

A device package, comprising:

• a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface, the lid disposed on a substrate, wherein the one or more legs of the lid are attached to the substrate with a sealant, and wherein the bottom surface of the lid has a recess therein;
• one or more dies disposed on the substrate, wherein the one or more dies are below the bottom surface of the lid, wherein each of the dies has a top surface and a bottom surface that is opposite from the top surface;
• a retaining structure disposed between the bottom surface of the lid and the top surface of the die, wherein the retaining structure has one or more inner walls, and wherein the retaining structure extends into the recess in the bottom surface of the lid;
• a pedestal disposed between the bottom surface of the lid and the top surface of the die, wherein the inner walls of the retaining structure surround the pedestal;
• and
• a thermal interface material disposed within the one or more inner walls of the retaining structure, wherein the thermal interface material extends into the recess in the bottom surface of the lid.

A device package, comprising:

• a lid with one or more legs on an outer periphery of the lid, a top surface, and a bottom surface that is opposite from the top surface, the lid disposed on a substrate, wherein the one or more legs of the lid are attached to the substrate with a sealant;
• one or more dies disposed on the substrate, wherein the one or more dies are below the bottom surface of the lid, wherein each of the dies has a top surface and a bottom surface that is opposite from the top surface;
• a retaining structure disposed between the bottom surface of the lid and the top surface of the die, wherein the retaining structure has one or more inner walls;
• a pedestal disposed between the bottom surface of the lid and the top surface of the die, wherein the inner walls of the retaining structure surround the pedestal;
• and
• a thermal interface material disposed within the one or more inner walls of the retaining structure, wherein the retaining structure is directly disposed on the top surface of the die or the bottom surface of the lid without an adhesive layer, wherein the retaining structure includes one or more different shapes, including a picture frame retaining structure, a ring retaining structure, and an angled retaining structure, wherein the retaining structure includes one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, and ceramics, wherein the pedestal is directly disposed on the top surface of the die or the bottom surface of the lid without an adhesive layer, wherein the pedestal includes one or more different shapes, wherein the pedestal includes one or more materials, and wherein the one or more materials include at least one or more of metals, metal alloys, metal-ceramic composites, polymers, polymer-metal composites, polymer-ceramic composites, epoxy, and ceramics, and wherein at least one of the retaining structure and pedestal on the top surface of the die or the bottom surface of the lid is deposited using a cold spray process.