Semiconductor device and semiconductor element
AssigneeMitsubishi Electric Corporation
InventorYosuke Nakata
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Abstract
The semiconductor device includes a substrate, a semiconductor element bonded to the substrate, and a sealing resin sealing at least a part of the substrate and the semiconductor element, in which the semiconductor element includes an active region through which a main current flows in an ON state of the semiconductor element, a terminal region surrounding the active region, an anchor film provided on an insulating film of the terminal region, and a protective film covering at least the terminal region including the anchor film, and the anchor film consists of a material different from the insulating film and has a plurality of openings provided discretely.
Claims11
A semiconductor device comprising:
- a substrate;
- a semiconductor element bonded to the substrate;
- and
- a sealing resin sealing at least a part of the substrate and the semiconductor element, wherein
- the semiconductor element includes
- an active region through which a main current flows in an ON state of the semiconductor element,
- a terminal region surrounding the active region,
- an anchor film provided on an insulating film of the terminal region, and
- a protective film covering at least the terminal region including the anchor film, and
- the anchor film consists of a material different from the insulating film and has a plurality of openings provided discretely.
A semiconductor element comprising:
- an active region through which a main current flows in an ON state;
- a terminal region surrounding the active region;
- an anchor film provided on an insulating film of the terminal region;
- and
- a protective film covering at least the terminal region including the anchor film, wherein
- the anchor film consists of a material different from the insulating film and has a plurality of openings provided discretely over the whole thereof.
Dependencies are inferred from the claim text.