Pressure-activated electrical interconnection with additive repair

A repaired electrical connection structure, comprising:

• a substrate comprising a first contact pad and a second contact pad;
• a first adhesive layer disposed over and in contact with at least a first portion of the substrate, wherein the first portion is adjacent to, on, or adjacent to and on the first contact pad;
• a first component disposed in alignment with, and electrically connected to, the first contact pad, wherein the first adhesive layer contacts at least a portion of the first component between the first component and the substrate;
• a second adhesive layer disposed over and in contact with at least a second portion of the substrate, wherein the second portion is adjacent to, on, or adjacent to and on the second contact pad;
• and
• a second component disposed in alignment with, and electrically connected to, the second contact pad, wherein the second adhesive layer contacts at least a portion of the second component between the second component and the substrate and the second adhesive layer is disposed at least partially over the first component and not disposed over the second component,
• wherein the first component and the second component are designed to be functionally identical and the first component is a faulty component, and
• wherein the first component and the second component do not overlap one another in a direction perpendicular to a surface of the substrate on which the first and the second component are disposed.