Conductive wafer lift pin o-ring gripper with resistor
AssigneeApplied Materials, Inc.
InventorsRoberto Cesar Cotlear, Michael D. Willwerth
Life of this patent
Estimating the term…
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AssigneeApplied Materials, Inc.
InventorsRoberto Cesar Cotlear, Michael D. Willwerth
Estimating the term…
Embodiments of the present disclosure generally relate to a lift pin assembly used for de-chucking substrates. The lift pin assembly includes a base and one or more lift pin holders. Each lift pin holder includes a first portion and a second portion. The first portion is coupled to the base by a metal connector and the second portion is coupled to the first portion by a metal connector. A resistor is disposed in the first portion of the lift pin holder. The second portion includes a lift pin support for supporting a lift pin. The lift pin, the lift pin support, and the metal connectors are electrically conductive. The base is connected to a reference voltage, such as the ground, forming a path for the residual electrostatic charge in the substrate from the substrate to the reference voltage.
A lift pin assembly, comprising:
A lift pin assembly, comprising:
A plasma processing chamber, comprising:
Dependencies are inferred from the claim text.