Wafer container and method for holding wafer

A wafer container, comprising:

• a frame having a first sidewall and a second sidewall extending along a YZ plane, wherein the entire first sidewall is parallel with the entire second side wall;
• a plurality of first support structures, disposed on the first sidewall and alternately arranged along a Z direction, wherein each first support structure comprises:
• a first connection portion disposed on the first sidewall and extending along a Y direction;
• and
• a plurality of first comb portions connected to the first connection portion, extending along a X direction, and alternately arranged along the Y direction;
• and
• a plurality of second support structures, disposed on the second sidewall and alternately arranged along the Z direction, wherein each second support structure comprises:
• a second connection portion disposed on the second sidewall and extending along the Y direction;
• and
• a plurality of second comb portions connected to the second connection portion, extending along the X direction, and alternately arranged along the Y direction,
• wherein one of the plurality of first support structures is horizontally aligned with a corresponding second support structure to constitute a wafer holder,
• wherein the wafer holder comprises a plurality of island structures to hold a wafer in a XY plane, and the plurality of island structures are separated to each other along the X direction.

A method for holding at least one wafer, comprising:

• providing a wafer container comprising a frame having opposite sidewalls and at least a pair of support structures respectively disposed on the sidewalls of the frame, wherein the at least a pair of support structures comprise a first supporting structure and a second supporting structure opposite to each other,
• the first support structure has a first connection portion extending along a Y direction and a plurality of first comb portions connected to the first connection portion, extending along a X direction, and alternately arranged along the Y direction, wherein one of the plurality of first comb portions comprises a first main portion and a plurality of first island structures disposed over the first main portion, and the plurality of first island structures are separated from each other,
• the second support structure has a second connection portion extending along the Y direction and a plurality of second comb portions connected to the second connection portion, extending along the X direction, and alternately arranged along the Y direction, wherein one of the plurality of second comb portions comprises a second main portion and a plurality of second island structures disposed over the second main portion and the plurality of second island structures are separated from each other;
• and
• inserting the wafer into the wafer container, so that the at least a pair of support structures are configured to provide at least three supporting points to support the wafer in a XY plane.