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US 11,387,122 B2Granted
Method and apparatus for measuring process kit centering
AssigneeApplied Materials, Inc.
InventorsCharles Potter, Eli Mor
Life of this patent
Estimating the term…
Abstract
Embodiments disclosed herein include a sensor wafer. In an embodiment, the sensor wafer comprises a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface. In an embodiment, the sensor wafer further comprises a plurality of sensor regions formed along the edge surface, wherein each sensor region comprises a self-referencing capacitive sensor.
Claims11
A sensor wafer, comprising:
- a substrate, wherein the substrate comprises a first surface, a second surface opposite the first surface, and an edge surface between the first surface and the second surface;
- and
- a plurality of sensors positioned along the edge surface, wherein each sensor is a capacitive sensor, and wherein each sensor comprises a first probe and a second probe, the first probe laterally adjacent to the second probe, wherein an output phase of the first probe is 180 degrees offset from an output phase of the second probe.
Dependencies are inferred from the claim text.