Substrate treating apparatus and substrate treating system including pin lift mechanism below cooling base and heat plate
AssigneeSCREEN Holdings Co., Ltd.
InventorsTatsuhisa Tsuji, Yasuhiro Fukumoto, Yasuhiro Shiba
Life of this patent
Estimating the term…
Abstract
Disclosed is a substrate treating apparatus that performs a heat treatment to a substrate. The apparatus includes the following elements: a heat treating plate that heats the substrate; lift pins that deliver the substrate, a lift pin drive mechanism that causes the lift pins to move upwardly/downwardly; a casing that produces a heat treatment atmosphere; and a cooling base plate that suppresses transmission of heat from the heat treating plate. The lift pin drive mechanism is disposed below the cooling base plate.
Claims15
A substrate treating apparatus that performs a heat treatment to a substrate, the apparatus comprising:
- a heat treating plate that heats the substrate placed thereon;
- lift pins that deliver the substrate;
- a lift pin drive mechanism that causes the lift pins to move upwardly/downwardly relative to a top face of the heat treating plate;
- a casing that covers surroundings of the heat treating plate to produce a heat treatment atmosphere by the heat treating plate;
- and
- a cooling base plate above which the heat treating plate is placed to suppress transmission of heat from the heat treating plate downwardly, the lift pin drive mechanism being disposed below the cooling base plate,
- wherein the casing includes a load/unload opening that is used for loading/unloading the substrate;
- a shutter body that opens/closes the load/unload opening;
- and
- a shutter body drive mechanism that drives the shutter body, the shutter body drive mechanism being disposed below the cooling base plate.
Dependencies are inferred from the claim text.