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US 11,387,118 B2Granted
Integrated circuit packages and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chien-Hsun Lee, Chi-Yang Yu, Jung Wei Cheng, Chin-Liang Chen
Life of this patent
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Abstract
Integrated circuit packages and methods of forming the same are disclosed. A first die is mounted on a first side of a workpiece, the workpiece including a second die. The workpiece is mounted to a front side of a package substrate, where the first die is at least partially disposed in a through hole in the package substrate. A heat dissipation feature may be attached on a second side of the workpiece. An encapsulant may be formed on the front side of the package substrate around the workpiece.
Claims20
A method comprising:
- bonding a die stack to a workpiece, the die stack comprising one or more integrated circuit dies;
- after bonding the die stack to the workpiece, mounting the workpiece on a first side of a package substrate, the package substrate comprising a through hole, wherein the die stack is at least partially disposed in the through hole of the package substrate;
- after mounting the workpiece to the package substrate, attaching a heat dissipation feature to the workpiece, the workpiece being interposed between the heat dissipation feature and the die stack, wherein the heat dissipation feature is completely separated from the package substrate;
- and
- after attaching the heat dissipation feature, forming a first encapsulant on the first side of the package substrate, the first encapsulant having a lateral extent less than a lateral extent of the package substrate, wherein the first encapsulant extends over the heat dissipation feature, wherein the first encapsulant contacts sidewalls of the heat dissipation feature and extends along sidewalls of the heat dissipation feature, and wherein the first encapsulant contacts sidewalls of the workpiece and extends along sidewalls of the workpiece;
- and
- removing a portion of the first encapsulant over the heat dissipation feature to expose a surface of the heat dissipation feature.
4 more elements
A method comprising:
- forming a semiconductor device, the semiconductor device comprising one or more dies;
- forming first connectors and second connectors on a first side of the semiconductor device, wherein forming each of the second connectors comprises plating a conductive column on the first side of the semiconductor device and depositing a solder material on the conductive column, the conductive column extending further from the first side of the semiconductor device than the first connectors;
- mounting a second die to the first connectors on the first side of the semiconductor device, wherein following mounting the second die, each of the conductive columns of the second connectors overlap sidewalls of the second die;
- after mounting the second die to the first connectors, mounting the semiconductor device to a front side of a package substrate by the second connectors, the second die being at least partially disposed in a cavity of the package substrate;
- after mounting the semiconductor device to the package substrate, attaching a heat dissipation feature to a surface of a second side of the semiconductor device, the heat dissipation feature extending laterally further than the semiconductor device, the second side being at an opposite surface from the first side;
- forming a second encapsulant on the front side of the package substrate, the second encapsulant surrounding the second connectors, wherein the second encapsulant surrounds the heat dissipation feature, the second encapsulant having a first lateral extent, the package substrate having a second lateral extent, the first lateral extent less than the second lateral extent;
- and
- removing a portion of the second encapsulant over the heat dissipation feature to expose a surface of the heat dissipation feature.
5 more elements
A method comprising:
- forming a workpiece by a process comprising:
- attaching a die to a carrier substrate,
- forming redistribution structure over the die, the redistribution structure comprising one or more redistribution layers, the redistribution structure electrically coupled to the die,
- forming first connectors coupled to the redistribution structure and second connectors coupled to the redistribution structure, and
- mounting a second die to the first connectors;
- singulating the workpiece to form a first semiconductor device, a back side of the die being exposed;
- after forming the first semiconductor device, bonding the second connectors of the first semiconductor device to a front side of a package substrate, the second die being at least partially disposed in a through hole of the package substrate;
- after bonding the second connectors of the first semiconductor device to the package substrate, attaching a heat dissipation feature to the first semiconductor device, the heat dissipation feature extending laterally further than lateral extents of the first semiconductor device, sidewalls of the first semiconductor device being exposed from the heat dissipation feature;
- and
- after attaching the heat dissipation feature, depositing a first encapsulant laterally surrounding the heat dissipation feature and the first semiconductor device.
7 more elements
Dependencies are inferred from the claim text.