Surface processing apparatus

Abstract

This disclosure relates to a surface processing apparatus for use in the surface processing of a substrate. The surface processing apparatus comprises a plasma source including a wall defining a plasma chamber and an excitation source adjacent the wall and a processing chamber in which a substrate having a predetermined maximum lateral dimension is mounted in use, the processing chamber being operatively connected to the plasma source. A transmission plate for the transmission of plasma in use is arranged between the plasma source and processing chamber, the transmission plate comprising a plurality of apertures. The apertures follow a non-rectilinear path through the transmission plate such that there is no line of sight in use between a substrate with the predetermined maximum lateral dimension mounted in the processing chamber and the most intense region of the plasma in the plasma chamber.

Dependencies are inferred from the claim text.