Back to results
US 11,387,040 B2Granted
Producing method of module
AssigneeNitto Denko Corporation
InventorsKeisuke Okumura, Yoshihiro Furukawa
Life of this patent
Estimating the term…
Abstract
A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.
Claims15
A method for producing a module comprising:
- preparing a conductive layer disposed on one side surface in a thickness direction of a first peeling layer,
- forming a conductive pattern from the conductive layer, transferring the conductive pattern from the first peeling layer onto a surface of a first adhesive layer and then peeling the first peeling layer, subsequently
- pushing the conductive pattern into the first adhesive layer containing first magnetic particles and a first resin component to embed the conductive pattern,
- and
- after the peeling of the first peeling layer, the method further comprises disposing a second peeling layer on a surface of the conductive pattern from which the first peeling layer was peeled,
- pushing the conductive pattern into the first adhesive layer by press-bonding the second peeling layer with respect to the first adhesive layer, and
- peeling the second peeling layer from the conductive pattern and the first adhesive layer.
4 more elements
Dependencies are inferred from the claim text.