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US 11,387,033 B2Granted
High-aspect ratio electroplated structures and anisotropic electroplating processes
AssigneeHutchinson Technology Incorporated
InventorsDouglas P. Riemer, Kurt C. Swanson, Peter F. Ladwig, Matthew S. Lang, Paul V. Pesavento, Joseph D. Starkey
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Abstract
A device includes a dielectric layer having a first surface and a second surface. The device also includes a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer and a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
Claims20
A device comprising:
- a conductive substrate etched or plated to include at least a first set of traces;
- a dielectric layer disposed on the conductive substrate, the dielectric layer having a first surface and a second surface;
- at least a second set of traces disposed on the first surface of the dielectric layer;
- a first metal crown portion formed over at least a portion of each trace of the second set of traces to form a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer;
- and
- a second metal crown portion formed over at least a portion of each trace of the first set of traces to form a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
3 more elements
A coil comprising:
- a conductive substrate etched or plated to include a first plurality of traces;
- a dielectric layer disposed on the conductive substrate, the dielectric layer having a first surface and a second surface;
- a second plurality of traces disposed on the first surface of the dielectric layer;
- a first metal crown portion formed over at least a portion of each trace of the second plurality of traces to form a first set of high-aspect ratio electroplated structures disposed on the first surface of the dielectric layer;
- and
- a second metal crown portion formed over at least a portion of each trace of the first plurality of traces to form a second set of high-aspect ratio electroplated structures disposed on the second surface of the dielectric layer opposite the first set of high-aspect ratio electroplated structures.
3 more elements
Dependencies are inferred from the claim text.