US 11,386,975 B2 · Three-dimensional stacked memory device and method

Abstract

A three-dimensional stacked memory device includes a buffer die having a plurality of core die memories stacked thereon. The buffer die is configured as a buffer to occupy a first space in the buffer die. The first memory module, disposed in a second space unoccupied by the buffer, is configured to operate as a cache of the core die memories. The controller is configured to detect a fault in a memory area corresponding to a cache line in the core die memories based on a result of a comparison between data stored in the cache line and data stored in the memory area corresponding to the cache line in the core die memories. The second memory module, disposed in a third space unoccupied by the buffer and the first memory module, is configured to replace the memory area when the fault is detected in the memory area.

Claims20

Dependent claims

A three-dimensional stacked memory device, comprising:

a plurality of core die memories;
and
a buffer die having the plurality of core die memories stacked thereon and a buffer configured to occupy a first space in the buffer die, the buffer die comprising:
a first memory module, disposed in a second space unoccupied by the buffer and, configured to operate as a cache of the plurality of core die memories;
a second memory module, disposed in a third space unoccupied by the buffer and the first memory module;
and
a controller configured to:
detect a fault in a memory area corresponding to a cache line in the plurality of core die memories based on a result of a comparison between data stored in the cache line and data stored in the memory area corresponding to the cache line in the plurality of core die memories;
and
replace the memory area when the fault is detected in the memory area,
wherein the cache line is of entries in the first memory module.

8 more elements

A method of a three-dimensional stacked memory device including a plurality of core die memories and a buffer die having a buffer configured to occupy a first space in the buffer die, the method comprising:

receiving a result of a comparison between data stored in a cache line of entries in a first memory module and data stored in a memory area corresponding to the cache line in the plurality of core die memories, the first memory module, disposed in a second space unoccupied by the buffer and, configured to operate as a cache of the plurality of core die memories;
detecting a fault in the memory area based on the comparison result;
and
controlling a second memory module, disposed in a third space unoccupied by the buffer and the first memory module, to replace the memory area, upon detecting the fault in the memory area.

1 more element

Dependencies are inferred from the claim text.

Three-dimensional stacked memory device and method

Life of this patent

Three-dimensional stacked memory device and method

Life of this patent

Abstract

Claims20