Smart chip assembly capable of communicating with each other and variable array in packaging

A smart chip assembly, comprising:

• a package containing at least three intelligent single-chip modules interconnected in an array of a predetermined format and cut to complete an integrated structure, wherein each of said at least three intelligent single-chip modules is installed with a camera lens module, wherein said camera lens module of each of said at least three intelligent single-chip modules obtains images of an object of interest at different angles or depths of field, wherein said at least three intelligent single-chip modules communicate therebetween to calculate and analyze images and image dynamics acquired by said camera lens module of each of said at least three intelligent single-chip modules to obtain a resulting identification of said object of interest, said package being configured to transmit said resulting identification as a command to a connected power mechanism to perform corresponding actions, wherein said predetermined format of said array of said at least three intelligent single-chip modules is selected from a group consisting of:
• three of said intelligent single-chip modules arranged in a single row,
• three of said intelligent single-chip modules arranged in two rows in a zig-zag fashion, four of said single-chip modules arranged side-by-side in a single row, and four of said single-chip modules arranged in two rows and two columns fashion.