Physical unclonable function (PUF) chip

Abstract

A physical unclonable function (PUF) chip is provided. The physical unclonable function (PUF) chip includes a chip with a top metal connection layer, an array of spaced electrode plates on the top metal connection layer of the chip, a deposition layer, on the top metal connection layer between each two adjacent electrode plates. An opening is formed between the each two adjacent electrode plates in a row, and each two adjacent electrode plates are tangential to the opening formed between the two adjacent electrode plates. The physical unclonable function (PUF) chip further includes a conductive coating layer on the chip and the conductive coating layer includes conductive particles with randomly distributed size, and a package substrate, packaged with the chip including the conductive coating layer.

Dependencies are inferred from the claim text.