Security circuitry for bonded structures
AssigneeInvensas Bonding Technologies, Inc.
InventorsJavier A. DeLaCruz, Belgacem Haba, Guy Regev
Life of this patent
Estimating the term…
Abstract
A bonded structure is disclosed. The bonded structure can include a first semiconductor element having a first front side and a first back side opposite the first front side. The bonded structure can include a second semiconductor element having a second front side and a second back side opposite the second front side, the first front side of the first semiconductor element directly bonded to the second front side of the second semiconductor element along a bond interface without an adhesive. The bonded structure can include security circuitry extending across the bond interface, the security circuitry electrically connected to the first and second semiconductor elements.
Claims27
A bonded structure comprising:
- a first semiconductor element having a first front side and a first back side opposite the first front side;
- a second semiconductor element having a second front side and a second back side opposite the second front side, the first front side of the first semiconductor element directly bonded to the second front side of the second semiconductor element along a bond interface without an adhesive;
- and
- security circuitry extending across the bond interface, the security circuitry electrically connected to the first and second semiconductor elements, the security circuitry configured to prevent external access to at least some data or circuitry in at least one of the first and second semiconductor elements.
A bonded structure comprising:
- a first semiconductor element having a first front side and a first back side opposite the first front side;
- a second semiconductor element having a second front side and a second back side opposite the second front side, the first front side of the first semiconductor element bonded to the second front side of the second semiconductor element along a bond interface, the second semiconductor element comprising an active security circuit block;
- and
- a first dummy security circuit block in at least the first semiconductor element, wherein the first dummy security circuit block comprises circuitry having features of security circuitry but not functioning as security circuitry.
A method of forming a bonded structure, the method comprising:
- forming a first security circuit block in a first semiconductor element;
- forming a second security circuit block in a second semiconductor element;
- and
- directly bonding the first semiconductor element to the second semiconductor element without an adhesive such that the first and second security circuit blocks are electrically connected, the electrically connected first and second security blocks configured to prevent external access to at least some data or circuitry in at least one of the first and second semiconductor elements.
Dependencies are inferred from the claim text.