Encapsulated component attachment technique using a UV-cure conductive adhesive
AssigneeTektronix, Inc.
InventorsJulie A. Campbell, Karl A. Rinder, Regina R. Mrozik
Life of this patent
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Abstract
A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.
Claims20
A method for acquiring a signal from an encapsulated test point on a device under test, the method comprising:
- forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point;
- delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point;
- applying UV light from a UV light source to cure the delivered adhesive;
- and
- connecting a conductive element between the cured adhesive and a test and measurement instrument.
A system for electrically connecting a test and measurement instrument to a test point in a device under test, the system comprising:
- a tube containing a pre-determined volume of a UV-curable conductive adhesive, the pre-determined volume selected based on the diameter of the tube so that the adhesive, when cured, establishes electrical contact between the test point and a conductive element proximate to the test point;
- and
- a handheld UV light source for a user to be able to direct UV light to cure the adhesive at the test point.
Dependencies are inferred from the claim text.