Radio frequency module and communication device

A communication device, comprising:

• an antenna;
• a radio frequency (RF) signal processing circuit configured to process radio frequency signals transmitted and received by the antenna;
• and
• a radio frequency module configured to transfer the radio frequency signals between the antenna and the RF signal processing circuit, wherein
• the radio frequency module includes
• a module board including a first principal surface and a second principal surface on opposite sides of the module board;
• a first power amplifier disposed on the first principal surface and configured to amplify a transmission signal of a first frequency band;
• a second power amplifier disposed on the first principal surface and configured to amplify a transmission signal of a second frequency band different from the first frequency band;
• a first output transformer disposed inside the module board or on the second principal surface and including a first coil and a second coil;
• and
• a second output transformer disposed inside the module board or on the second principal surface and including a third coil and a fourth coil, wherein
• the first power amplifier includes a first amplifying element and a second amplifying element,
• the second power amplifier includes a third amplifying element and a fourth amplifying element,
• a first end of the first coil is connected to an output terminal of the first amplifying element, a second end of the first coil is connected to an output terminal of the second amplifying element, and a first of the second coil is connected to an output terminal of the first power amplifier, and
• a first end of the third coil is connected to an output terminal of the third amplifying element, a second end of the third coil is connected to an output terminal of the fourth amplifying element, and a first end of the fourth coil is connected to an output terminal of the second power amplifier.

A radio frequency module comprising:

• a module board including a first principal surface and a second principal surface on opposite sides of the module board;
• a first power amplifier disposed on the first principal surface and including a first amplifying element and a second amplifying element;
• a second power amplifier disposed on the first principal surface and including a third amplifying element and a fourth amplifying, element;
• a first output transformer disposed inside the module board or on the second principal surface and including a first coil, and
• a second output transformer disposed inside the module board or on the second principal surface and including a second coil, wherein
• a first end of the first coil is connected to an output terminal of the first amplifying element, and a second end of the first coil is connected to an output terminal of the second amplifying element, and
• a first end of the second coil is connected to an output terminal of the third amplifying element, and a second end of the second coil is connected to an output terminal of the fourth amplifying element.