Back to results
US 11,381,005 B2Granted
Semiconductor device, communication system, and method of manufacturing semiconductor device
AssigneeLapis Semiconductor Co., Ltd.
InventorHiroji Akahori
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first antenna element, a second antenna element, and a semiconductor chip including a communication circuit that is connected to the first antenna element and the second antenna element. The first antenna element and the second antenna element are disposed on opposite surfaces of the semiconductor chip. The first antenna element or the second antenna element to which a ground potential is applied has a grid-like pattern.
Claims1
A semiconductor device, comprising:
- a first antenna element and a second antenna element receiving a first signal from a communication device provided outside the semiconductor device;
- and
- a semiconductor chip including a communication circuit provided between the first antenna element and the second antenna element, the communication circuit being connected to the first and second antenna elements,
- wherein the first antenna element and the second antenna element are disposed on opposite surfaces of the semiconductor chip,
- the second antenna element to which a ground potential is applied has a grid pattern which is formed by first wirings extending in a first direction and intersecting with second wirings extending in a second direction orthogonal to the first direction, and
- the first antenna element has a one-line pattern which reciprocates meanderingly in the first direction parallel to one of the opposite surfaces of the semiconductor chip.
3 more elements
Dependencies are inferred from the claim text.