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US 11,380,979 B2Granted
Antenna modules and communication devices
AssigneeIntel Corporation
InventorsSidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, William James Lambert, Benjamin Jann
Life of this patent
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Abstract
Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
Claims25
An antenna module, comprising:
- a first die, comprising logic circuitry;
- a second die, comprising radio frequency front-end (RFFE) circuitry, the second die in electrical communication with the first die;
- and
- an antenna patch, wherein the second die is closer to the antenna patch than the first die is to the antenna patch.
1 more element
A communication device, comprising:
- a first die, comprising logic circuitry;
- a second die, comprising radio frequency front-end (RFFE) circuitry, the second die in electrical communication with the first die;
- an antenna patch, wherein the second die is closer to the antenna patch than the first die is to the antenna patch;
- and
- a display.
2 more elements
Dependencies are inferred from the claim text.