Electronic package and method for fabricating the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsShi-Min Zhou, Han-Hung Chen, Rung-Jeng Lin, Kuo-Hua Yu, Chang-Fu Lin
Life of this patent
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Abstract
An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.
Claims27
An electronic package, comprising:
- a first substrate having an antenna structure, wherein the first substrate has a first surface, a second surface opposing the first surface, and at least one through hole communicating the first surface with the second surface;
- a second substrate having a circuit layer, wherein the second substrate and the first substrate are stacked on each other;
- a plurality of conductive elements of a post shape disposed between the first substrate and the second substrate;
- at least one supporting body of the post shape disposed between the first substrate and the second substrate and securing the first substrate and the second substrate, wherein the through hole corresponds in position to the supporting body;
- and
- a central open region, a middle connecting region, and a peripheral supporting region defined between the first substrate and the second substrate, wherein the central open region is free from being formed with adhesive material or molding compound, the conductive elements are disposed in the middle connecting region, and the supporting body is disposed in the peripheral supporting region.
A method for fabricating an electronic package, comprising:
- stacking a first substrate on a second substrate through a plurality of conductive elements of a post shape, wherein the first substrate has an antenna structure and the second substrate has a circuit layer, and wherein the first substrate has a first surface, a second surface opposing the first surface, and at least one through hole communicating the first surface with the second surface;
- disposing between the first substrate and the second substrate at least one supporting body of the post shape securing the first substrate and the second substrate, wherein the through hole corresponds in position to the supporting body;
- and
- defining a central open region, a middle connecting region, and a peripheral supporting region between the first substrate and the second substrate, with the conductive elements being disposed in the middle connecting region and the supporting body being disposed in the peripheral supporting region, wherein the central open region is free from being formed with adhesive material or molding compound.
Dependencies are inferred from the claim text.