Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYusuke Kobayashi, Hiro Gangi, Tomoaki Inokuchi, Ryohei Gejo
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYusuke Kobayashi, Hiro Gangi, Tomoaki Inokuchi, Ryohei Gejo
Estimating the term…
According to one embodiment, a semiconductor device includes first, second, and third electrodes, first, second, and third semiconductor regions, a first member, and a first insulating member. A direction from the first electrode toward the second electrode is along a first direction. The first semiconductor region includes first, second, and third partial regions. A second direction from the second partial region toward the first partial region crosses the first direction. The third partial region is between the second partial region and the second semiconductor region in the first direction. The third semiconductor region is provided between the third partial region and the second semiconductor region. The first insulating member includes a first insulating region and a second insulating region. The first insulating region is between the third partial region and the first member. The second insulating region is between the third semiconductor region and the third electrode.
A semiconductor device, comprising:
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.