Display substrate, method for manufacturing the same, and display device
AssigneeBoe Technology Group Co., Ltd.
InventorsHua Huang, Changhan Hsieh, Muxin Di, Xiaoyan Zhu
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure provide a display substrate, a method for manufacturing a display substrate, and a display device. The method for manufacturing the display substrate includes: providing a seed layer on a first carrier substrate and forming a base substrate covering the seed layer; forming a first connection terminal on a side of the base substrate away from the first carrier substrate, the first connection terminal electrically connecting to the seed layer; removing the first carrier substrate to expose the seed layer; and forming a second connection terminal electrically connecting to the seed layer.
Claims9
A method for manufacturing a display substrate, comprising:
- providing a seed layer on a first carrier substrate and forming a base substrate covering the seed layer;
- forming a first connection terminal on a side of the base substrate away from the first carrier substrate, the first connection terminal electrically connecting to the seed layer;
- removing the first carrier substrate to expose the seed layer;
- and
- forming a second connection terminal electrically connecting to the seed layer;
- wherein, before forming the first connection terminal, the method further comprises:
- forming at least one via hole, the at least one via hole at least extending through the base substrate;
- and
- forming at least one injected electrically-conductive layer in the at least one via hole,
- wherein the first connection terminal is electrically connected to the seed layer through the at least one injected electrically-conductive laver;
- wherein the at least one via hole comprises a first via hole and a second via hole, the at least one injected electrically-conductive layer comprises a first injected electrically-conductive layer and a second injected electrically-conductive layer, and the method comprises:
- forming the first via hole that extends through the base substrate to expose the seed layer, and forming the first injected electrically-conductive layer in the first via hole;
- forming a thin film transistor on the side of the base substrate away from the first carrier substrate, an electrode of the thin film transistor being connected to the first injected electrically-conductive layer;
- and
- forming the second via hole to expose the first injected electrically-conductive layer, and forming the second injected electrically-conductive layer that is connected to the first injected electrically-conductive layer in the second via hole,
- wherein the first connection terminal is electrically connected to the seed layer through the first injected electrically-conductive layer and the second injected electrically-conductive layer.
Dependencies are inferred from the claim text.