Semiconductor dice assemblies, packages and systems, and methods of operation
AssigneeMicron Technology, Inc.
InventorsEiichi Nakano, Shiro Uchiyama
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Abstract
A semiconductor device assembly, including an interposer comprising a glass material, a semiconductor die comprising a proximity coupling on a side of the interposer, and at least one other semiconductor die comprising a proximity coupling configured for communicating signals with the proximity coupling of the semiconductor die, on an opposing side of the interposer. The assembly may optionally be configured for optical signal communication with higher level packaging. Semiconductor device packages, systems and methods of operation are also disclosed.
Claims21
An assembly, comprising:
- an interposer;
- a semiconductor die comprising a proximity coupling on a side of the interposer;
- and
- at least one other semiconductor die on an opposing side of the interposer and comprising a proximity coupling configured for communicating signals through the interposer with the proximity coupling of the semiconductor die.
A method of operating a semiconductor device, comprising:
- communicating signals between a logic die and one or more memory dice through proximity coupling;
- and
- communicating power and ground/bias with each of the logic die and the one or more memory dice with electrically conductive structure terminating external to the semiconductor device.
An electronic system, comprising:
- an input device;
- an output device;
- a processor device operably coupled to the input device and the output device;
- and
- a semiconductor device operably coupled to the processor device and comprising:
- a stack structure comprising:
- a logic die;
- a stack of memory dice operably coupled to the logic die through proximity couplings of the logic die and a memory die of the stack of memory dice;
- and
- an interposer comprising a glass material located between the stack of memory dice and the logic die.
Dependencies are inferred from the claim text.