Electronic device comprising optical electronic components and manufacturing method

An electronic device, comprising:

• an opaque dielectric carrier and confinement substrate including a stack of layers laminated on top of one another, wherein said stack comprises a solid back layer and a front frame including a peripheral wall and an intermediate partition so as to delimit two cavities positioned over the solid back layer and on either side of the intermediate partition;
• an electronic integrated circuit (IC) chip positioned inside each cavity of said two cavities and mounted on top of the solid back layer, wherein each electronic IC chip includes an integrated optical element;
• electrical connections between each electronic IC chip and back electrical contacts of the solid back layer;
• transparent encapsulation blocks that are molded in the two cavities and which embed the electronic IC chips;
• wherein the electrical connections comprise electrical contacts in the two cavities on a surface of the front frame;
• and
• wherein the electrical connections comprise electrical connection vias passing through the front frame from said electrical contacts.

An electronic device, comprising:

• an opaque dielectric carrier and confinement substrate including a stack of layers laminated on top of one another, wherein said stack comprises a solid back layer and a front frame including a peripheral wall and an intermediate partition so as to delimit two cavities positioned over the solid back layer and on either side of the intermediate partition;
• an electronic integrated circuit (IC) chip positioned inside each cavity of said two cavities and mounted on top of the solid back layer, wherein each electronic IC chip includes an integrated optical element;
• electrical connections between each electronic IC chip and back electrical contacts of the solid back layer;
• transparent encapsulation blocks that are molded in the two cavities and which embed the electronic IC chips;
• wherein the front frame comprises a first layer which is laminated on top of the solid back layer and a second layer laminated on top of the first layer, wherein the first layer includes surface portions that protrude into the two cavities and are not covered by the second layer.

An electronic device, comprising:

• an opaque dielectric carrier and confinement substrate including a stack of layers laminated on top of one another, wherein said stack comprises a solid back layer and a front frame including a peripheral wall and an intermediate partition so as to delimit two cavities positioned over the solid back layer and on either side of the intermediate partition;
• an electronic integrated circuit (IC) chip positioned inside each cavity of said two cavities and mounted on top of the solid back layer, wherein each electronic IC chip includes an integrated optical element;
• electrical connections between each electronic IC chip and back electrical contacts of the solid back layer;
• transparent encapsulation blocks that are molded in the two cavities and which embed the electronic IC chips;
• and
• a light-filtering optical die on a top surface of each transparent encapsulation block positioned facing the integrated optical element.