Manufacturing method of micro-LED display device
OwnerXiaobo Huinventor
Life of this patent
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Abstract
The present disclosure provides a manufacturing method of a micro-LED display device. In the method, a display backboard and a substrate are made separately, and then the display backboard and the substrate are synthesized, after the substrate is removed, a micro-LED array, a protective layer, and a transparent electrode layer are formed on the display backboard formed with an LED single crystal film layer. Beneficial effect is that LED transfer bonding can be self-aligned, conventional mass transfer process can be avoided, process is simple, production cost is reduced, and product yield and pixels of the micro-LED display device are greatly improved.
Claims20
A manufacturing method of a micro-LED display device, comprising following steps:
- S10, providing a substrate and depositing an LED single crystal film layer on the substrate at an ambient temperature greater than 1000° C.;
- S20, providing a display backboard, manufacturing a driving circuit on the display backboard, and disposing touch spots on a side of the driving circuit facing away from the display backboard;
- S30, covering the driving circuit of the display backboard with a dielectric layer, and defining through holes in the dielectric layer, and the through holes directly facing the touch spots;
- S40, forming molten metal dots above the touch spots along the through holes;
- S50, aligning the substrate on which the LED single crystal film layer is deposited with the display backboard, so that one side of the LED single crystal film layer is directly opposite to a side of the dielectric layer having the metal dots;
- S60, applying pressure to the substrate facing away from the LED single crystal film layer and a side of the display backboard facing away from the dielectric layer, respectively, so that the LED single crystal film layer and the dielectric layer are completely attached and bonded together;
- S70, peeling the substrate from an entirety of the LED single crystal film layer and the display backboard;
- S80, performing a yellow light process and an etching process on a side of the LED single crystal film layer facing away from the display backboard to form a micro-LED array;
- and
- S90, forming a protective layer by a filling process and a transparent electrode layer on a side of the dielectric layer facing away from the display backboard to form a complete micro-LED display device.
A manufacturing method of a micro-LED display device, comprising following steps:
- S10, providing a substrate and depositing an LED single crystal film layer on the substrate;
- S20, providing a display backboard, manufacturing a driving circuit on the display backboard, and disposing touch spots on a side of the driving circuit facing away from the display backboard;
- S30, covering the driving circuit of the display backboard with a dielectric layer, and defining through holes in the dielectric layer, and the through holes directly facing the touch spots;
- S40, forming molten metal dots above the touch spots along the through holes;
- S50, aligning the substrate on which the LED single crystal film layer is deposited with the display backboard, so that one side of the LED single crystal film layer is directly opposite to a side of the dielectric layer having the metal dots;
- S60, applying pressure to the substrate facing away from the LED single crystal film layer and a side of the display backboard facing away from the dielectric layer, respectively, so that the LED single crystal film layer and the dielectric layer are completely attached and bonded together;
- S70, peeling the substrate from an entirety of the LED single crystal film layer and the display backboard;
- S80, performing a yellow light process and an etching process on a side of the LED single crystal film layer facing away from the display backboard to form a micro-LED array;
- and
- S90, forming a protective layer by a filling process and a transparent electrode layer on a side of the dielectric layer facing away from the display backboard to form a complete micro-LED display device.
Dependencies are inferred from the claim text.