Batch manufacture of component carriers
AssigneeAT&S Austria Technologie & Systemtechnik Aktiengesellschaft
InventorsHeinz Moitzi, Dietmar Drofenik
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Abstract
A method of manufacturing a batch of component carriers is disclosed. The method includes providing a plurality of separate wafer structures, each comprising a plurality of electronic components, simultaneously laminating the wafer structures with at least one electrically conductive layer structure and at least one electrically insulating layer structure, and singularizing a structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components, a part of the at least one electrically conductive layer structure and a part of the at least one electrically insulating layer structure.
Claims12
A method of manufacturing a batch of component carriers, the method comprising:
- providing a plurality of separate wafer structures each comprising a plurality of electronic components on a common panel of a base structure comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the plurality of separate wafer structures are integrally arranged on the common panel by lamination;
- wherein all wafer structures are arranged within a common plane;
- wherein at least part of the wafer structures is a full wafer and/or
- wherein at least part of the wafer structures is a partial wafer;
- and afterwards
- simultaneously laminating, wherein laminating comprises the application of pressure and heat, the wafer structures with at least one further electrically conductive layer structure and at least one further electrically insulating layer structure to form a cover structure to cover the wafer structures and part of the base structure;
- singularizing a wafer structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components from one of the singularized wafer structures, a part of the at least one further electrically conductive layer structure and/or a part of the at least one further electrically insulating layer structure;
- wherein the at least one electrically insulating layer structure comprises at least one of the group consisting of reinforced resin, epoxy resin, Bismaleimide-Triazine resin, cyanate ester, glass, prepreg material, liquid crystal polymer, epoxy-based Build-Up Film, FR4 material, FR5 material, polytetrafluoroethylene, a ceramic, a metal oxide.
A method of manufacturing a batch of component carriers, the method comprising:
- providing a plurality of separate wafer structures each comprising a plurality of electronic components on a common panel of a base structure comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure, wherein the plurality of separate wafer structures are integrally arranged on the common panel by lamination;
- wherein all wafer structures are arranged within a common plane;
- wherein at least part of the wafer structures is a full wafer and/or wherein at least part of the wafer structures is a partial wafer;
- and afterwards
- simultaneously laminating the wafer structures with at least one further electrically conductive layer structure and at least one further electrically insulating layer structure to form a cover structure to cover the wafer structures and part of the base structure;
- singularizing a wafer structure resulting from the laminating into the plurality of component carriers, each comprising at least one of the electronic components from one of the singularized wafer structures, a part of the at least one further electrically conductive layer structure and/or a part of the at least one further electrically insulating layer structure;
- the method further comprising:
- forming prior to the singularizing, a plurality of through connections, using a laser, extending through the at least one electrically insulating layer structure for electrically contacting at least one of the group consisting of the electronic components and the at least one electrically conductive layer structure.
Dependencies are inferred from the claim text.