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US 11,380,648 B2Granted
Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsLéa Di Cioccio, Jean Berthier, Nicolas Posseme
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Abstract
The invention concerns a support intended for the implementation of a method of self-assembly of at least one element on a surface of the support, including at least one assembly pad on said surface, a liquid drop having a static angle of contact on the assembly pad smaller than or equal to 15°, and nanometer- or micrometer-range pillars on said surface around the pad, the liquid drop having a static angle of contact on the pillars greater than or equal to 150°.
Claims13
A method of self-assembly of an element onto a surface of a support comprising the steps of:
- providing a support comprising:
- at least one assembly pad on said surface;
- and
- nanometer- or micrometer-range pillars on said surface around the at least one assembly pad, each nanometer- or micrometer-range pillar comprising at least one cylindrical or truncated cone amorphous silicon or polysilicon core;
- depositing a drop of a liquid on the at least one assembly pad, the liquid drop having a static angle of contact on the at least one assembly pad smaller than or equal to 15°, the liquid drop having a static angle of contact on the nanometer- or micrometer-range pillars greater than or equal to 150°;
- and
- bringing the element into contact with the drop, which results in a self-assembly of the element with respect to the support.
4 more elements
Dependencies are inferred from the claim text.