Sintering press and method for sintering electronic components on a substrate

A sintering press to perform a sintering of electronic components on a substrate, comprising a pressing unit comprising a multi-rod cylinder having a front head and a rear head which jointly delimit a compression chamber, in said front head presser rods parallel and independent of each other being slidingly supported, each presser rod having a rod axis coincident with the barycenter of the respective electronic component to be sintered and having a thrust section proportional to the force to be applied to the respective electronic component, the area of each electronic component to be sintered being known, and for a predetermined sintering pressure, in which in the compression chamber a sealing membrane extends which hermetically divides the compression chamber into a rear chamber and a front chamber, the rear chamber being in fluidic communication with an inlet passage of a fluid under pressure at the sintering pressure, the rear ends of the pressure rods projecting into the front chamber, the sealing membrane being placed to skim said rear ends (28′) of the pressure rods so that, when the rear chamber is pressurised at the sintering pressure, the sealing membrane is deformed so as to abut against said rear ends for a transfer of the sintering pressure on each presser rod.