Rounded metal trace corner for stress reduction
AssigneeIntel Corporation
InventorsDae-Woo Kim, Ajay Jain, Neha M. Patel, Rodrick J. Hendricks, Sujit Sharan
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Abstract
An integrated circuit package is disclosed. The integrated circuit package comprises a first integrated circuit die and a second integrated circuit die. The integrated circuit package further includes a substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the substrate. The substrate includes an interconnect bridge embedded within the substrate, wherein the interconnect bridge includes at least one metal trace component, wherein the metal trace component includes rounded corners on a bottom portion of the metal trace component.
Claims20
A multi-die IC package, comprising:
- a substrate;
- an interconnect bridge embedded in the substrate, the interconnect bridge comprising:
- a layer comprising silicon and oxygen;
- and
- a metal trace in the layer comprising silicon and oxygen, the metal trace having a rounded bottom surface, and the metal trace comprising copper;
- and
- a first die electrically coupled to the interconnect bridge and to the substrate;
- and
- a second die electrically coupled to the interconnect bridge and to the substrate.
A multi-die IC package, comprising:
- a substrate;
- an interconnect bridge embedded in the substrate, the interconnect bridge comprising:
- a layer comprising silicon and oxygen;
- a groove in the layer comprising silicon and oxygen, the groove having a rounded bottom surface;
- and
- a metal trace in the groove, the metal trace comprising copper;
- and
- a first die electrically coupled to the interconnect bridge and to the substrate;
- and
- a second die electrically coupled to the interconnect bridge and to the substrate.
Dependencies are inferred from the claim text.