Shielding structures

A method, comprising:

• receiving a design of a device package to be bonded to a substrate, wherein the device package includes a rectangular shape and the rectangular shape includes a geometric center;
• determining a threshold radius from the geometric center based on a difference between a first coefficient of thermal expansion (CTE) coefficient of the device package and a second CTE of the substrate;
• positioning a circle having the threshold radius over the device package such that a center of the circle coincides with the geometric center;
• using a first-type contact pad in a first area of the device package outside the circle;
• and
• using a second-type contact pad in a second area of the device package outside the circle.

A method, comprising:

• receiving a design of a device package including a first coefficient of thermal expansion (CTE) and a rectangular shape, wherein the rectangular shape comprises a first corner, a second corner, a third corner, and a fourth corner;
• determining a threshold radius from a geometric center of the rectangular shape based on a difference between the first CTE and a second CTE of a substrate;
• overlapping a center of a circle having the threshold radius with the geometric center to identify a first cross point and a second cross point adjacent the first corner, a third cross point and a fourth cross point adjacent the second corner, a fifth cross point and a sixth cross point adjacent the third corner, and a seventh cross point and an eighth cross point adjacent the fourth corner, wherein the first cross point, the second cross point, and the first corner define a first triangular area, the third cross point, the fourth cross point, and the second corner defines a second triangular area, the fifth cross point, the sixth cross point, and the third corner define a third triangular area, and the seventh cross point, the eighth cross point, and the fourth corner define a fourth triangular area;
• using a first-type contact pad in the first triangular area, the second triangular area, the third triangular area, and the fourth triangular area;
• and
• using a second-type contact pad in an area of the device package other than the first triangular area, the second triangular area, the third triangular area, and the fourth triangular area.