Semiconductor package

A semiconductor package, comprising:

• a semiconductor chip on which a connection pad is disposed, and including a passivation film having a first opening exposing at least a portion of the connection pad and a protective film disposed on the passivation film, filling at least a first portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening;
• an encapsulant covering at least a portion of the semiconductor chip;
• and
• a connection structure disposed on an active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via,
• wherein the second opening has a width narrower than a width of the first opening, and
• wherein the connection structure includes an insulating layer disposed on the active surface of the semiconductor chip, the insulating layer filling at least a second portion of the first opening.