Radio frequency module

A radio frequency module, comprising:

• a radio frequency integrated circuit (RFIC) configured to input or output a base signal and a radio frequency (RF) signal comprising a frequency higher than a frequency of the base signal;
• a wiring via extending from the RFIC in an upward direction and configured to provide a transmission path of the RF signal;
• a feed line electrically connected to the wiring via and configured to provide the transmission path of the RF signal;
• a second ground layer surrounding the feed line;
• a first ground layer spaced apart from the second ground layer in an upward direction;
• a third ground layer disposed between the second ground layer and the RFIC;
• a feed-line insulating layer disposed between the first and the third ground layers;
• at least one IC wiring layer disposed between the third ground layer and the RFIC, electrically connected to the RFIC, and comprising at least one portion configured to provide a transmission path of the base signal;
• at least one IC insulating layer disposed between the third ground layer and the RFIC;
• and
• one or more of a first insulating adhesive layer in contact with a lower surface of the feed-line insulating layer and a second insulating adhesive layer in contact with an upper surface of the feed-line insulating layer, wherein a dielectric constant of the at least one IC insulating layer is higher than a dielectric constant of the feed-line insulating layer.