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US 11,380,632 B2Granted
Semiconductor package device with integrated inductor and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Shiang Liao, Huan-Neng Chen
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Abstract
A semiconductor device includes a semiconductor substrate and an interconnect structure over the semiconductor substrate. The interconnect structure includes a magnetic core and a conductive coil winding around the magnetic core and electrically insulated from the magnetic core. The conductive coil includes horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the conductive lines.
Claims20
A semiconductor device, comprising:
- a semiconductor substrate;
- and
- an interconnect structure over the semiconductor substrate, wherein the interconnect structure comprises:
- a magnetic core;
- a conductive coil winding around the magnetic core and electrically insulated from the magnetic core, wherein the conductive coil comprises horizontally-extending conductive lines and vertically-extending conductive vias electrically connecting the horizontally-extending conductive lines, wherein the magnetic core and the conductive coil are arranged in an inductor zone of the interconnect structure;
- and
- a dielectric material electrically insulating the magnetic core from the conductive coil,
- wherein the vertically-extending conductive vias comprises first conductive vias in contact with a first one of the horizontally-extending conductive lines, second conductive vias overlapping the first conductive vias and in contact with a second one of the horizontally-extending conductive lines opposite to the first one of the horizontally-extending conductive lines, and a third conductive via between the first conductive vias and the second conductive vias, and the third conductive via has a width greater than a width of the first conductive vias or the second conductive vias, and wherein the third conductive via comprises a bottom surface substantially level with a bottom surface of the magnetic core,
- wherein the first conductive vias are arranged on a same side of the magnetic core and separated by the dielectric material,
- wherein the interconnect structure further comprises a connecting metal line adjacent to and on the outside of the inductor zone, the connecting metal line being electrical isolated from the inductor zone, wherein the connecting metal line includes an upper surface lower than an upper surface of the second conductive vias and a bottom surface higher than a bottom surface of the first conductive vias;
- a first semiconductor die over the interconnect structure;
- a second semiconductor die adjacent to the first semiconductor die over the interconnect structure;
- a first encapsulating material filling spaces between the interconnect structure and each of the first semiconductor die and the second semiconductor die;
- and
- a second encapsulating material, different from the first encapsulating material, filling a gap of the first encapsulating material between the first and second semiconductor dies, wherein the second encapsulating material has a top surface level with an upper surface of the first semiconductor die and a bottom surface contacting the first encapsulating material.
12 more elements
A semiconductor device, comprising:
- a substrate;
- a first semiconductor die and a second semiconductor die over the substrate, wherein the second semiconductor die is adjacent to the first semiconductor die;
- and
- an interconnect structure between the substrate and the first semiconductor die, the interconnect structure comprising a plurality of metallization layers forming an interconnection path and an inductor electrically isolated from the interconnection path,
- wherein the plurality of metallization layers comprise first metal features in an inductor zone to form a coil of the inductor and comprise a magnetic region extending within the coil of the inductor,
- wherein the coil comprises first conductive vias in a first metallization layer, second conductive vias in a second metallization over the first metallization layer, and a third conductive via in a third metallization layer between the first conductive vias and the second conductive vias, and the third conductive via has a width greater than a width of the first conductive vias or the second conductive vias, and wherein the third conductive via comprises a bottom surface substantially level with a bottom surface of the magnetic region,
- wherein the first conductive vias are spaced apart from one another and the second conductive vias are spaced apart from one another,
- wherein interconnection path comprise second metal features outside the inductor zone, the second metal features including a plurality of connecting metal vias parallel to each other in the first metallization layer or the second metallization layer, wherein each of the connecting metal vias is electrically isolated from the inductor zone, and has an upper surface and a bottom surface aligned with an upper surface and a bottom surface, respectively, of each of the first or second conductive vias;
- a first encapsulating material filling spaces between the interconnect structure and each of the first semiconductor die and the second semiconductor die;
- and
- a second encapsulating material, different from the first encapsulating material, filling a gap of the first encapsulating material between the first and second semiconductor dies, wherein the first encapsulating material surrounds a lateral side and a bottom surface of the second encapsulating material.
8 more elements
A semiconductor device, comprising:
- a semiconductor substrate;
- a first semiconductor die over the semiconductor substrate;
- an interconnect structure electrically coupling the semiconductor substrate to the first semiconductor die, wherein the interconnect structure comprises:
- a magnetic core;
- first metal lines over and electrically insulated from the magnetic core;
- second metal lines beneath and electrically insulated from the magnetic core;
- metal vias laterally spaced apart from the magnetic core and connecting the first metal lines to the second metal lines to form a conduction path winding around the magnetic core,
- wherein the magnetic core and the conduction path is arranged in an inductor zone of the interconnect structure,
- wherein the metal vias comprises first metal vias arranged in a first metallization layer, second metal vias arranged in a second metallization layer over the first metallization layer and a third metal via between the first metallization layer and the second metallization layer, and the third metal via has a width greater than a width of the first metal vias or the second metal vias, and wherein the third metal via comprises a bottom surface substantially level with a bottom surface of the magnetic core;
- a connecting metal line adjacent to and on the outside of the inductor zone, the connecting metal line being electrical isolated from the inductor zone and having an upper surface and a bottom surface aligned with an upper surface and a bottom surface, respectively, of the magnetic core;
- and
- a plurality of connecting metal vias parallel to each other and electrically coupled to the bottom surface or the upper surface of the connecting metal line, wherein each of the connecting metal vias is electrically isolated from the inductor zone, and has an upper surface and a bottom surface aligned with an upper surface and a bottom surface, respectively, of each of the first or second conductive vias;
- a first dielectric layer laterally surrounding the first metal vias;
- and
- a second dielectric layer over the first dielectric layer and laterally surrounding the first metal vias, wherein the second dielectric layer separates the first dielectric layer from the magnetic core;
- a second semiconductor die over the interconnect structure and adjacent to the first semiconductor die;
- a first encapsulating material filling spaces between the interconnect structure and each of the first semiconductor die and the second semiconductor die;
- and
- a second encapsulating material, different from the first encapsulating material, filling a gap of the first encapsulating material between the first and second semiconductor dies, wherein the first encapsulating material extends from a sidewall of the first semiconductor die, via a bottom surface of the second encapsulating material and to a sidewall of the second semiconductor die.
16 more elements
Dependencies are inferred from the claim text.