Package structure and method for fabricating the same

A package structure, comprising:

• a mounting pad having a mounting surface;
• a semiconductor chip disposed on the mounting surface of the mounting pad,
• wherein the semiconductor chip comprises:
• a first surface perpendicular to a thickness direction of the semiconductor chip;
• a second surface opposite to the first surface and facing the mounting surface;
• and
• a third surface connecting the first surface and the second surface;
• a molding at least partially encapsulating the semiconductor chip;
• a magnetic device disposed in the semiconductor chip;
• and
• a first magnetic field shielding, comprising:
• a first portion proximal to the third surface of the semiconductor chip, wherein the first portion has a first height calculated from the mounting surface to a top surface;
• and
• a second portion distal to the semiconductor chip, has a second height calculated from the mounting surface to a top surface, wherein the second height is less than the first height wherein at least a portion of a bottom surface of the second portion of the first magnetic field shielding is free from being in direct contact with the molding.

A package structure, comprising:

• a mounting pad having a mounting surface;
• a semiconductor chip having a magnetic device,
• wherein the semiconductor chip comprises:
• a first surface perpendicular to a thickness direction of the semiconductor chip;
• a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad;
• and
• a third surface connecting the first surface and the second surface;
• a lead frame, connected to the semiconductor chip with a bonding wire;
• and
• a first magnetic field shielding over the mounting surface and at least partially surrounding the third surface, wherein the first magnetic field shielding further comprises a first gap adjacent to a first corner of the semiconductor chip and a second gap adjacent to a second corner of the semiconductor chip different from the first corner, wherein at least a portion of the first gap is at a level above the second surface of the semiconductor chip.