US 11,380,625 B2 · Shielding structure, semiconductor package structure with shielding structure

Abstract

A semiconductor package structure is provided. The semiconductor package structure includes a first device, a second device, and a shielding structure. The first device and the second device is one a first side of a substrate. The shielding structure includes a first portion and a second portion. The first portion is between the first device and the second device on the substrate, and the first portion includes a plurality of first shielding units arranged along a first direction. The second portion is between the first device and the second device, and the second portion includes a plurality of second shielding units arranged along a second direction different from the first direction. The second portion is configured as a first waveguide between the first device and the second device.

Claims17

Dependent claims

A semiconductor package structure, comprising:

a first device and a second device on a first side of a substrate;
a shielding structure, comprising:
a first portion between the first device and the second device on the substrate, the first portion comprising a plurality of first shielding units arranged along a first direction;
and
a second portion between the first device and the second device, the second portion comprising a plurality of second shielding units arranged along a second direction different from the first direction,
wherein the second portion is configured as a first waveguide between the first device and the second device;
and
wherein a pitch of the first shielding units is smaller than a pitch of the second shielding units.

5 more elements

Dependencies are inferred from the claim text.

Shielding structure, semiconductor package structure with shielding structure

Life of this patent

Shielding structure, semiconductor package structure with shielding structure

Life of this patent

Abstract

Claims17