Electromagnetic interference shield created on package using high throughput additive manufacturing

A method of forming a device package, comprising:

• disposing one or more dies on a substrate having a ground plane, wherein the one or more dies are electrically coupled to the substrate with a plurality of solder balls surrounded by an underfill layer;
• disposing a mold layer over and around the one or more dies, the underfill layer, and the substrate, wherein the mold layer is on a backside surface of the one or more dies, the backside surface opposite the substrate;
• and
• disposing an additively manufactured EMI shield layer or frame directly on at least one of an outer surface of the mold layer or the substrate without using an adhesive layer, wherein the additively manufactured EMI shield layer or frame is electrically coupled to the ground plane of the substrate.

A device package, comprising:

• a substrate having a ground plane;
• one or more dies disposed on the substrate, wherein the one or more dies are electrically coupled to the substrate with solder balls surrounded by an underfill layer;
• a mold layer disposed over and around the underfill layer and the substrate, wherein the mold layer is disposed around the one or more dies, wherein the mold layer is on a backside surface of the one or more dies, the backside surface opposite the substrate;
• and
• one or more additively manufactured EMI shield layers or frames directly disposed on an outer surface of the mold layer and a top surface of the substrate without an adhesive layer, wherein the additively manufactured EMI shield layer or frame is electrically coupled to the ground plane of the substrate.