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US 11,380,620 B2Granted
Semiconductor package including cavity-mounted device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJiun Yi Wu, Chen-Hua Yu
Life of this patent
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Abstract
A semiconductor package and methods of forming the same are disclosed. In an embodiment, a package includes a substrate; a first die disposed within the substrate; a redistribution structure over the substrate and the first die; and an encapsulated device over the redistribution structure, the redistribution structure coupling the first die to the encapsulated device.
Claims20
A package comprising:
- a substrate;
- a first die disposed within the substrate, wherein a back surface of the first die is attached to the substrate by a first adhesive;
- a first underfill material between the first die and the substrate, the first underfill material extending along a first sidewall of the first adhesive and a second sidewall of the first die from the back surface of the first die to a front surface of the first die, wherein at least a portion of the first sidewall is aligned with at least a portion of the second sidewall;
- a redistribution structure over the substrate and the first die;
- an encapsulated device over the redistribution structure, the redistribution structure coupling the first die to the encapsulated device;
- a plurality of conductive connectors bonding the encapsulated device to the redistribution structure;
- and
- a second underfill material extending between the redistribution structure and the encapsulated device, the second underfill material surrounding the plurality of conductive connectors, the second underfill material comprising a material different from an encapsulant encapsulating the encapsulated device.
5 more elements
A semiconductor package comprising:
- a substrate;
- a first die attached to the substrate by an adhesive, wherein the first die is disposed within the substrate between a first sidewall of the substrate and a second sidewall of the substrate;
- a redistribution structure over the substrate and the first die, the redistribution structure having a width equal to a width of the substrate, the redistribution structure comprising a dielectric layer and a molding compound layer, the molding compound layer comprising a first material different from a second material of the dielectric layer;
- a first semiconductor device attached to the redistribution structure and electrically coupled to the redistribution structure;
- a second semiconductor device attached to the redistribution structure adjacent the first semiconductor device in a direction parallel to a major surface of the substrate and electrically coupled to the redistribution structure;
- and
- an encapsulant surrounding the first semiconductor device and the second semiconductor device, wherein a top surface of the first semiconductor device opposite the substrate, a top surface of the second semiconductor device opposite the substrate, and a top surface of the encapsulant opposite the substrate are level with one another.
4 more elements
A semiconductor package comprising:
- a first device attached to a substrate, wherein the first device is disposed in a cavity in the substrate, the cavity comprising opposite sidewalls and a mounting surface extending between the opposite sidewalls, wherein the first device is attached to the mounting surface, and wherein the first device is disposed between the opposite sidewalls;
- a first dielectric layer over the substrate, the first dielectric layer comprising an opening having a first width equal to a second width of the cavity;
- an underfill surrounding the first device, the underfill comprising a concave top surface opposite the mounting surface of the substrate, the concave top surface extending from a side surface of the first dielectric layer to a side surface of the first device;
- a second device electrically coupled to the first device, the second device being disposed over the first device in a direction perpendicular to a major surface of the substrate;
- and
- an encapsulant surrounding the second device.
3 more elements
Dependencies are inferred from the claim text.