Semiconductor device and method of manufacturing semiconductor device

A semiconductor device comprising:

• a first substrate being substantially plate-shaped, the first substrate including a first surface provided with a first wiring pattern, a second wiring pattern, and a third wiring pattern, and including a second surface being opposite to the first surface and provided with a fourth wiring pattern that is a heat dissipation member;
• a second substrate being substantially plate-shaped, the second substrate including a third surface provided with a fifth wiring pattern, and including a fourth surface being opposite to the third surface and provided with a sixth wiring pattern that is a heat dissipation member, the third surface being provided in an upper side of the first substrate and facing the first surface;
• a switching element being substantially plate-shaped and provided on the first substrate, the switching element including one surface provided with a source terminal and a gate terminal, and including another surface provided with a drain terminal, the source terminal being connected to the first wiring pattern and the gate terminal being connected to the second wiring pattern;
• an electronic component being substantially plate-shaped and provided under the second substrate, the electronic component including one surface provided with a first terminal and including another surface provided with a second terminal, the first terminal being connected to the fifth wiring pattern;
• a first electrode including a plate-shaped portion and provided between the switching element and the electronic component, and including a linking section connecting the plate-shaped portion and the third wiring pattern, the drain terminal being connected to a fifth surface of the plate-shaped portion, and the second terminal being connected to a sixth surface opposite to the fifth surface of the plate-shaped portion;
• and
• a second electrode being columnar and provided between the first substrate and the second substrate and connecting the first wiring pattern and the fifth wiring pattern, the second electrode being provided in an opposite side to the linking section with the switching element interposed;
• wherein a thickness of the plate-shaped portion is less than or equal to a thickness of each of the first wiring pattern, the second wiring pattern, the third wiring pattern, the fourth wiring pattern, the fifth wiring pattern, and the sixth wiring pattern.