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US 11,380,609 B2Granted
Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
AssigneeIntel Corporation
InventorsCheng Xu, Jiwei Sun, Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown
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Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
Claims20
A microelectronic assembly, comprising:
- a package substrate including a core having a surface;
- a first conductive feature, having a first thickness and a first length, directly on the surface of the core, wherein the first conductive feature includes a trace, and wherein the first length is between 15 microns and 30 microns;
- and
- a second conductive feature having a second thickness directly on the surface of the core, wherein the second conductive feature includes a trace or a pad, wherein the second thickness is different than the first thickness, and wherein the second conductive feature is spaced apart from the first conductive feature by a distance between 15 microns and 30 microns.
1 more element
A microelectronic assembly, comprising:
- a package substrate, the package substrate comprising:
- a core having a surface;
- and
- a first trace, having a first thickness and a first length, directly on the surface of the core, wherein the first length is between 15 microns and 30 microns;
- and
- a second trace having a second thickness directly on the surface of the core, wherein the second thickness is different than the first thickness, wherein the second trace is spaced apart from the first trace by a distance between 15 microns and 30 microns;
- and
- a die coupled to the package substrate and electrically coupled to the first trace via conductive pathways in the package substrate.
5 more elements
Dependencies are inferred from the claim text.