Semiconductor module

A semiconductor module, comprising:

• a substrate on which first, second, and third circuit boards that are electrically isolated from each other are formed;
• a semiconductor element having an upper surface electrode and a lower surface electrode, arranged on an upper surface of the first circuit board so that the lower surface electrode is electrically connected to the first circuit board;
• a connecting member that bridges the upper surface electrode of the semiconductor element and the second circuit board so as to electrically connect the upper surface electrode to the second circuit board;
• a wire that electrically connects the third circuit board to a first electrode that is located outside of where the first, second and third circuit boards are located in a plan view;
• and
• a sealing resin that covers and seals the substrate, the semiconductor element, the connecting member, and the wire,
• wherein the wire is wired from the third circuit board to the first electrode so as to cross the semiconductor element above the semiconductor element at a vertical position lower than an upper surface of the connecting member.