Methods of forming electronic assemblies with textured surfaces using low current density electroplating
AssigneesToyota Motor Engineering & Manufacturing North America, Inc., The Board of Trustees of the University of Illinois
InventorsShailesh N. Joshi, Paul Braun, Julia Kohanek, Gaurav Singhal
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Abstract
A method of forming a textured surface layer along a substrate that includes disposing a plurality of polymer spheres on a surface of the metal substrate, and electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate. The metal layer does not extend above a top surface of the plurality of polymer spheres. The method further includes removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
Claims12
A method of forming a textured surface along a metal substrate comprising:
- disposing a plurality of polymer spheres on a surface of the metal substrate;
- electroplating the metal substrate at a current density to deposit a metal layer along a body of each of the plurality of polymer spheres disposed on the surface of the metal substrate, wherein the metal layer does not extend above a top surface of the plurality of polymer spheres;
- and
- removing the plurality of polymer spheres from the metal layer to form the textured surface defined by a size and shape of the plurality of polymer spheres.
Dependencies are inferred from the claim text.