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US 11,380,601 B2Granted
Semiconductor device and method for manufacturing semiconductor device
AssigneeMurata Manufacturing Co., Ltd.
InventorsAtsushi Kurokawa, Yuichi Sano, Toshihiro Tada
Life of this patent
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Abstract
A semiconductor chip is mounted on a substrate in a face-down manner. A metal film is arranged on a back surface of the semiconductor chip facing an opposite side from the substrate away from an edge of the back surface. A sealing resin layer seals the semiconductor chip with a part of the metal film being exposed from the sealing resin layer.
Claims17
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted on the substrate in a face-down manner;
- a metal film arranged on a back surface of the semiconductor chip facing an opposite side from the substrate away from an edge of the back surface;
- and
- a sealing resin layer configured to seal the semiconductor chip with a part of the metal film being exposed from the sealing resin layer, wherein the sidewalls of the part of the metal film have a taper shape.
2 more elements
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted on the substrate in a face-down manner;
- a metal film arranged on a back surface of the semiconductor chip facing an opposite side from the substrate away from an edge of the back surface;
- and
- a sealing resin layer configured to seal the semiconductor chip with a part of the metal film being exposed from the sealing resin layer at an opening in the sealing resin layer extending to the semiconductor chip, wherein
- the metal film is continuous and fills the entirety of the opening and includes a portion extending from below an upper surface of the sealing resin layer to protrude upward from the upper surface of the sealing resin layer, and
- the metal film has a trapezoidal cross-sectional shape.
4 more elements
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted on the substrate in a face-down manner;
- a metal film arranged on a back surface of the semiconductor chip facing an opposite side from the substrate away from an edge of the back surface;
- and
- a sealing resin layer configured to seal the semiconductor chip with a part of the metal film being exposed from the sealing resin layer, wherein
- the metal film includes a portion projecting toward an outer side portion from a side surface.
3 more elements
Dependencies are inferred from the claim text.