Back to results
US 11,380,599 B2Granted
Semiconductor module, vehicle, and method of manufacturing semiconductor module
AssigneeFuji Electric Co., Ltd.
InventorsKohei Yamauchi, Tatsuhiko Asai
Life of this patent
Estimating the term…
Abstract
There is provided a semiconductor module including: a base for semiconductor cooling; a stacked substrate provided above the base; a semiconductor chip provided above the stacked substrate; a coating layer provided on an upper surface of the semiconductor chip; and a sealing resin for sealing the semiconductor chip, in which the base is in contact with the sealing resin.
Claims13
A method of manufacturing a semiconductor module, the method comprising:
- providing a base for semiconductor cooling;
- providing a stacked substrate above the base;
- providing a semiconductor chip above the stacked substrate;
- providing a coating layer on an upper surface of the semiconductor chip;
- and
- sealing the semiconductor chip with a sealing resin, wherein
- the base is in contact with the sealing resin, and
- wherein the coating layer is provided between the semiconductor chip and the sealing resin and is adapted to prevent the sealing resin from being peeled off from the semiconductor chip.
5 more elements
A semiconductor module comprising:
- a base for semiconductor cooling;
- a stacked substrate provided above the base;
- a semiconductor chip provided above the stacked substrate;
- a coating layer provided on an upper surface of the semiconductor chip;
- and
- a sealing resin sealing the semiconductor chip, wherein
- the base is in contact with the sealing resin, and
- wherein the coating layer is provided between the semiconductor chip and the sealing resin and is adapted to prevent the sealing resin from being peeled off from the semiconductor chip.
5 more elements
Dependencies are inferred from the claim text.