Bonded structures
AssigneeInvensas Bonding Technologies, Inc.
InventorsRajesh Katkar, Liang Wang
Life of this patent
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Abstract
A bonded structure is disclosed. The bonded structure can include a first element that has a first bonding surface. The bonded structure can further include a second element that has a second bonding surface. The first and second bonding surfaces are bonded to one another along a bonding interface. The bonded structure can also include an integrated device that is coupled to or formed with the first element or the second element. The bonded structure can further include a channel that is disposed along the bonding interface around the integrated device to define an effectively closed profile The bonded structure can also include a getter material that is disposed in the channel. The getter material is configured to reduce the diffusion of gas into an interior region of the bonded structure.
Claims19
A bonded structure comprising:
- a first element having a first bonding surface;
- a second element having a second bonding surface, the first and second bonding surfaces directly bonded to, and in direct contact with, one another along a bonding interface without an intervening adhesive;
- an integrated device coupled to or formed with the first element or the second element;
- a channel disposed along the bonding interface around the integrated device;
- and
- a getter material disposed in the channel, the getter material configured to reduce the diffusion of gas into an interior region of the bonded structure, the getter material completely enclosed by the directly bonded first and second elements with the bonding interface extending to the channel.
A bonded structure comprising:
- a first element;
- a second element directly bonded to, and in direct contact with, the first element along a bonding interface without an intervening adhesive;
- and
- a getter material disposed in a space along the bonding surface, the getter material configured to reduce the diffusion of gas into an interior region of the bonded structure, the getter material completely enclosed by the directly bonded first and second elements with the bonding interface extending to the space.
A bonded structure comprising:
- a first element having a first bonding surface;
- a second element having a second bonding surface, the first and second bonding surfaces directly bonded at room temperature to, and in direct contact with, one another along a bonding interface without an intervening adhesive;
- an integrated device coupled to or formed with the first element or the second element;
- a channel disposed along the bonding interface around the integrated device, the channel comprises a first trench disposed through the first bonding surface;
- and
- a getter material disposed in the channel, the getter material configured to reduce the diffusion of gas into an interior region of the bonded structure, the getter material completely enclosed by the directly bonded first and second elements with the bonding interface extending to the channel.
Dependencies are inferred from the claim text.