Cutting method

A cutting method for cutting a workpiece in a form of a plate along an intended cut line, the cutting method comprising:

• forming a reformed region in the workpiece along the intended cut line, by applying a laser beam while positioning a point of condensation in the workpiece;
• and
• after forming the reformed region in the workpiece, forming a groove in the workpiece along the intended cut line,
• in the forming a groove,
• a first dry etching process being performed from a front surface toward a rear surface of the workpiece,
• after the first dry etching process, a first pressure-reducing process being performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process, and
• after the first pressure-reducing process, a second dry etching process being performed from the front surface toward the rear surface of the workpiece.